Rushikesh Ajmire
11 months ago
rushikesh-ajmire
#business
AI at the Edge Needs Advanced Packaging at the Core
The advanced packaging market is revolutionizing semiconductor performance with 2.5D, 3D, fan-out, and SiP innovations. Driven by AI, 5G, IoT, and HPC, this market enables smaller, faster, and more efficient chips, making packaging a strategic pillar of next-gen electronics.
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